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Book Sections Year : 2015

Impact of voids in interconnection materials

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insu-01154803 , version 1 (23-05-2015)

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Pierre-Richard Dahoo, Malika Khettab, Christian Chong, Armelle Girard, Philippe Pougnet.. Impact of voids in interconnection materials. Abdelkhalak El Hami et Philippe Pougnet. Embedded Mechatronic Systems 2. Analysis of Failures, Modeling, Simulation and Optimization, Elsevier, Chapter 4, 2015, ISBN : 978-1-78548-014-0. ⟨10.1016/B978-1-78548-014-0.50004-9⟩. ⟨insu-01154803⟩
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